敘述: ADLINK's EOS-JNX series of NVIDIA Jetson-based Edge AI vision systems include integrated Nvidia Jetson Xavier NX, 4-channel PoE and digital I/O in a fanless chassis with verified thermal stability. The EOS-JNX series has a built-in Smart PoE feature to control PoE power remotely to reduce maintenance efforts in challenging environments and provides PoE power loss detection to alert of any unexpected PoE disconnection. The EOS-JNX-I is designed as an AI PoE switch for connecting to IP cameras to enable AI inferencing, and also provides an uplink port to connect to a network video recorder (NVR) for recording video streams, making upgrading existing surveillance systems easy. The EOS-JNX-G is designed for industrial AI machine vision applications, providing a dedicated bandwidth of 1Gb per channel with a GigE camera connection, which is crucial for production line and manufacturing applications. Moreover, by using the internal USB connector, users can install a software license dongle inside the chassis to avoid loss or theft of the dongle for even greater protection.

敘述: 應用範圍： 半導體晶圓製造、封裝、測試等產業 在廠內/廠外自動化搬送及包裝 適用包裝場合：8”&12”晶圓出貨及廠區間轉移 (包含Reel/HWS/TRAY包裝出貨) 適用晶圓盒：FOUP/FOSB(12") ; Reel/Jedec Tray/HWS/POD (8") 適用包裝袋：鋁袋、抗靜電袋、透明袋 主要功能： 晶圓盒自動包裝機(FOUP/FOSB Auto Packing Machine) 可依客戶需求將晶圓盒(FOUP、FOSB)、乾燥包(Desiccant)、濕度卡(Humidity Card)及客戶標籤(Customer Label)真空密封入客戶指定之袋型 (鋁袋、抗靜電袋、透明袋)內。 可節省人力成本、減少工安、提昇晶圓包裝品質、確保晶圓盒包裝之氣密性，有效降低人工作業產生之晶圓破片風險，符合智能產線智動化之需求。 標籤貼附：將客戶標籤貼附於包裝袋或FOUP(門板)上 乾燥劑及HIC卡：將乾燥劑及濕度卡(HIC)內置FOUP上 真空熱封：包裝袋包裝FOUP(可灌氮氣)後進行真空熱封 折袋與框膠：將熱封後袋口進行折袋整理並以膠帶固定

敘述: 應用範圍： 半導體晶圓製造、封裝、測試等產業 在廠內/廠外作自動化搬送及拆包 適用拆包場合：8”&12”晶圓入料及廠區間轉移 適用晶圓盒(FOUP)尺寸: W415*D330*~360*H335mm 適用包裝袋：鋁袋、抗靜電袋、透明袋 主要功能： 晶圓盒自動拆包機(FOUP/FOSB Auto Unpacking Machine) 可依客戶需求將包裝好的晶圓盒(FOUP、FOSB)與單層或雙層袋拆開，同時讀取/覆判帳料資訊。 可取代人工作業、減少人工拆包失誤，減少工安問題，維持產品品質，有效降低人工作業產生之晶圓破片風險，符合智能產線智動化之需求。 拆袋：將FOUP外的單雙層袋拆離 乾燥劑：將乾燥劑回收至集中桶內 廢袋集中：將廢袋收回集中桶槽 連結系統：結合包裝機與ASRS Docking