SLD8000 provides maximum one to thirty-six LED sorting automation system. With production scheduling and automatic loading and unloading system, SLD 8000 achieves manpower reduction and production efficiency improvement. The central control system integrated with automation system is optional, which provides machine production monitoring, real-time machine trouble shooting or other machine setting functions.

FCM8101X integrates high-efficiency laser and high-precision working system, by controlling microprocessor, high efficiency/quality drilling is achievable. It can be performed on various materials such as DPC Thin-Film ceramic, semi-conductive, PCB or metal sheet, etc.

Precision and efficiency laser wafer marking system from FitTech provides multiple marking forms, including texts, numbers, barcodes, 2D code, QR code, etc., for product identification and traceability through the manufacturing process.The system supports 2D code and OCR reading before and after wafer marking.

High accuracy 2D surface defect AOI Fastest review image capture system(up to 14 pics/sec) AI-auto defect classification

This product is mainly used in the grinding process after packaging. By leveling the Strip products to achieve functions such as thinning and heat dissipation

Applications: Semiconductor wafer manufacturing, packaging, testing and related industries Automated handling and packaging inside/outside the factory Uses: 8"" & 12"" wafer shipment and inter-fab transfer (including Reel/HWS/TRAY packaging and shipping) Applicable wafer shippers: FOUP/FOSB(12""); Reel/Jedec Tray/HWS/POD (8"") Types of packaging bags: aluminum bags, antistatic bags, transparent bags Main functions: FOUP/FOSB Automatic Packaging Machine Wafer shippers automatic packaging machine (FOUP, FOSB Auto Packing Machine). Can be customized to put wafer shippers (FOUP, FOSB..etc), Desiccant, Humidity Card, Customer Labels into to customer required bag types (aluminum bag, antistatic bag, transparent bag) and vacuum sealed the packaging. It can save labor costs, reduce safety concerns, improve the quality of wafer packaging, and ensure the airtightness of wafer shippes packaging. Effectively reduces the risk of wafer fragmentation caused by manual operations, and meet the needs of smart production. Label: Attach the customer's label to the bag or FOUP (door housing) Desiccant and HIC card: Place the desiccant and humidity card (HIC) on the FOUP Vacuum heat sealing: vacuum heat sealing after packaging FOUP (can be filled with nitrogen) in bags Folding bag and place tape: fold the bag mouth after heat sealing and fix it with tape.

Applications: Semiconductor wafer manufacturing, packaging, testing and related industries Automated handling and packaging inside/outside the factory Uses: 8"" & 12"" wafer shipment and inter-fab transfer (including Reel/HWS/TRAY packaging and shipping) Applicable wafer shippers: FOUP/FOSB(12""); Reel/Jedec Tray/HWS/POD (8"") Types of packaging bags: aluminum bags, antistatic bags, transparent bags Main functions: FOUP/FOSB Automatic Packaging Machine Wafer shippers automatic packaging machine (FOUP, FOSB Auto Packing Machine). Can be customized to put wafer shippers (FOUP, FOSB..etc), Desiccant, Humidity Card, Customer Labels into to customer required bag types (aluminum bag, antistatic bag, transparent bag) and vacuum sealed the packaging. It can save labor costs, reduce safety concerns, improve the quality of wafer packaging, and ensure the airtightness of wafer shippes packaging. Effectively reduces the risk of wafer fragmentation caused by manual operations, and meet the needs of smart production. Label: Attach the customer's label to the bag or FOUP (door housing) Desiccant and HIC card: Place the desiccant and humidity card (HIC) on the FOUP Vacuum heat sealing: vacuum heat sealing after packaging FOUP (can be filled with nitrogen) in bags Folding bag and place tape: fold the bag mouth after heat sealing and fix it with tape.

Applications: Semiconductor wafer packaging, testing and related industries Semiconductor mid-end process equipment . Front-end process: ADI, AEI, ASI….etc. . Advanced Packaging: Wafer Thinning, Bumping process . For wafers: 8"" & 12"" Main functions: Fully automatic wafer inspection (macro & micro) According to customer needs, it can perform macroscopic inspection of wafers such as: wafer corner chipping, cracks, abnormal wafer engraving, residual tin on the edge, etc. Supplemented by AI for defect classification; at the same time, it can perform microscopic inspection of wafers such as critical dimensions, offset, etc. It can replace manual operations, improve the speed and accuracy of wafer inspection, reduce false detection rate, and automatically report, store and analyze data. Meets the needs of smart production. · Fully automated wafer macroscopic inspection/micro inspection measurement · AOI+AI software defect detection and classification

Applications Semiconductor wafer packaging, testing and other related industries Semiconductor mid-end process equipment . For wafers: 8" & 12" Main functions: Laser Grooving Profile Measurement Equipment Measurements can be performed after wafer laser grooving and before Dicing Saw according to customer requirements. The measured wafers include 8" & 12" Contains the following measurement items: . Laser grooving depth measurement . Laser grooving upper edge width measurement . Laser grooving bottom width measurement . Laser grooving offset measurement